JPH0452017U - - Google Patents

Info

Publication number
JPH0452017U
JPH0452017U JP9539690U JP9539690U JPH0452017U JP H0452017 U JPH0452017 U JP H0452017U JP 9539690 U JP9539690 U JP 9539690U JP 9539690 U JP9539690 U JP 9539690U JP H0452017 U JPH0452017 U JP H0452017U
Authority
JP
Japan
Prior art keywords
molded product
film
injection molding
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9539690U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0727138Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9539690U priority Critical patent/JPH0727138Y2/ja
Publication of JPH0452017U publication Critical patent/JPH0452017U/ja
Application granted granted Critical
Publication of JPH0727138Y2 publication Critical patent/JPH0727138Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
JP9539690U 1990-09-10 1990-09-10 プリント回路基板用射出成形装置 Expired - Lifetime JPH0727138Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9539690U JPH0727138Y2 (ja) 1990-09-10 1990-09-10 プリント回路基板用射出成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9539690U JPH0727138Y2 (ja) 1990-09-10 1990-09-10 プリント回路基板用射出成形装置

Publications (2)

Publication Number Publication Date
JPH0452017U true JPH0452017U (en]) 1992-05-01
JPH0727138Y2 JPH0727138Y2 (ja) 1995-06-21

Family

ID=31834086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9539690U Expired - Lifetime JPH0727138Y2 (ja) 1990-09-10 1990-09-10 プリント回路基板用射出成形装置

Country Status (1)

Country Link
JP (1) JPH0727138Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014000744A (ja) * 2012-06-20 2014-01-09 Panasonic Corp インモールド成形方法およびインモールド装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014000744A (ja) * 2012-06-20 2014-01-09 Panasonic Corp インモールド成形方法およびインモールド装置

Also Published As

Publication number Publication date
JPH0727138Y2 (ja) 1995-06-21

Similar Documents

Publication Publication Date Title
KR100259661B1 (en) Manufacturing device and manufacturing method for multi-layer molded-product
JPS55118640A (en) Manufacture of semiconductor device
JPH0452017U (en])
JPS5926244U (ja) 半導体樹脂封入成形用の成形装置
JPS60105200U (ja) インサ−ト成形用転写シ−ト
JPH04125117A (ja) プリント回路基板およびその射出成形装置
JPH0552770B2 (en])
JPS57150551A (en) Unevenly decorated patterned container and its manufacture
JPH0217318U (en])
JPH028099U (en])
JPS6430722A (en) Injection molding device of multilayer printed circuit board
JPS6452718U (en])
JPS63166411U (en])
JPH0444885B2 (en])
JP2001239525A (ja) 樹脂成形品の部分加飾用金型及び加飾方法
JPS63106170U (en])
JPS6327222A (ja) 絵付樹脂成形品の製造方法
JPH01121966U (en])
JPH0435915B2 (en])
JPS6420770U (en])
JPS6418779U (en])
JPS59169911U (ja) 成形用金型
JPS5519580A (en) Formation of decoration pattern on resin mold surface
JPH0295618U (en])
JPS6147608U (ja) 複合成形品の成形装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term